Join Zierick at the SMT Show in Nuremberg, Germany

May 5-7, 2015

Zierick will once again participate on the Future Packaging Line and will be exhibiting a unique range of SMT Connectors at Hall 6, stand 434. Find out about our dual wire insulation piercing crimp terminal and range of discrete crimp terminals that simplify wire to board connections and eliminate secondary soldering processes. Discover our latest RF connector for RG174 cable that connects a shield and conductor in one termination process. Zierick has been manufacturing and innovating connectors since 1919.

Zierick will be at the Future Packaging line, with their agent Werner Wirth, hall 6 - stand 434, during the SMT Hybrid Packaging Fair, Nuremberg, Germany - May 5th to 7th, 2015.