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THE ARDENT
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Week of August 22, 2016                                                                                                                              Issue No. 12
Visit us at EDI CON 2016 - Booth #229 - Hynes Convention Center - Boston, MA
Have connector or socket needs? Come talk with us at EDI CON USA. The conference brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON USA to find solutions, products, and design ideas that they can put into immediate practice for today's communication, defense, consumer electronics, aerospace, and medical industries.
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We've Revised our TR Footprint Drawings!
In an effort to continually simplify implementation of TR Multicoax Series, our engineering team has revised our TR footprint drawings to make board layout quicker and more straightforward. As one customer put it, "“I can literally copy and paste TR footprint symbols from one board layout to the next.” See an example of the new drawings below.
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RC Space Transformer Interposer
Available in Modular Designs, the Ardent RC Space Transformer interposer is a lower force drop-in replacement for massively parallel spring-pin connectors and conductive elastomeric contact sets. Designed with RC SP™ technology, this space transformer interposer is a highly reliable discrete node z-axis interconnect solution for super-high-node-count applications. Extremely low force, consistent DC resistance and exceptional AC performance for Vertical Probe Card interface applications.
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In the News: IBM, AMD and Others Plan Assault on Intel’s Chip Dominance

"Few companies enjoy the kind of dominance Intel Corp. does in chips for the computers found in data centers. But competitors keep trying to pry open its server stronghold, with International Business Machines Corp. the latest to brandish a new tool."

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HFSS Modeling
Written by: Stephen Cristaldi, Applications Engineer
When working with high speed interconnect solutions, HFSS modeling becomes a vital part of the design process. HFSS stands for high frequency simulation software. HFSS is used to ensure the design can achieve the maximum signal power transfer. At high frequencies and high data transfer rates, signal integrity parameters become very tight and need to be well controlled. Running simulations with HFSS, one is able to gather expected values for insertion loss, return loss, and cross talk. These measurements are commonly expressed as S-parameters. Below is a list of the most common measurements values and their associated S parameters designation.

Insertion loss : S21, S12

Return Loss: S11, S22

Cross talk (near end): S31, S13

Cross talk (far end): S41, S14
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