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Oct 11, 2018

V-Score and Depanel in One Step

Can we score and de-panel assembled PCBs in one step to create a card edge connector on the PCB. Is there a precedence for doing this? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk

HASL Surface Finish and Coplanarity
We have a customer that has requested HASL surface finish. This assembly includes a 256 ball BGA component. Is coplanarity a concern?
Ask the Experts

Technical Papers

■	Enabling IPX Level 7/8 PCB Waterproof Protection
■	Say Goodbye To Stencils
■	Conformal Coatings that don't crack under pressure
■	Important Ways of Approaching Heat Management
■	PCB Prototyping for Smarties
■	Why Jobs Go On Hold
■	Case Studies Demonstrate Value-Added Services to Enable Client Success
■	Automated Visual Inspection and Correction (Demura) of OLED Displays

The Development of Hybrid Therma-EMI Solutions for Electronics
Test methods to measure the thermal and electromagnetic properties of a material in an application and as fundamental material properties are discussed.
Production Floor

The 5G Future Is Almost Here
Investments in 5G-compatible spectrum show economic promise of 5G wireless technology, slated to be rolled out in developed economies in 2019.
Technology Briefing

Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies
This study qualifies an aqueous cleaning process capable of removing combinations of no-clean flux residues for Class III electronic assemblies.
Analysis Lab

Advanced Thermal Management for High Power Applications
This paper gives a short overview about standard thermal solutions like thick copper, thermal vias, plugged vias or metal core based PCBs.
Materials Tech

Characterization, Prevention and Removal of Particulate Matter on PCBs
This paper describes a means of measuring the DRH of minute quantities of particulate matter (1 mg or less) found on PCBs.
Production Floor

BGA Solder Ball Shelf Life
BGA Solder Balls are a homogeneous mass of metals, why is the shelf life only two years? Can the shelf life be extended?
Ask the Experts

Double Reflow-Induced Brittle Interfacial Failures
This paper describes and characterizes an unusual open circuit failure mechanism in Pb-free ball grid array (BGA) solder joints.
Analysis Lab

How Frequently Should We Recheck Profiles?
Is it necessary to replicate thermal profiling during long-term mass production? Is it necessary to recheck accuracy of reflow oven profiles periodically?
Board Talk

Electroplating of Cu in TSV and Characteristics of Low Alpha Solder Bump
The research objective is to estimate metallurgical and mechanical properties of low alpha solder. Cu-filling property to TSV was also investigated.
Materials Tech

The Era of Quantum Computing Microprocessors Dawns
Research teams all over the world have been exploring different ways to design a working computer that can integrate quantum interactions.
Technology Briefing

Mechanical Shock and Drop Reliability Evaluation of the BGA Solder Joint Stack-Ups
This paper investigates the Mechanical Shock and Drop Reliability of SnAgCu ball Flip Chip BGA solder joints.
Production Floor

Zip-lock Bags vs. Heat Sealed Bags
Are zip-lock bags vs. heat sealed bags an acceptable option for storage of moisture sensitive components?
Ask the Experts

Jet Engine Bicycle Blasts Off
Definitely don't try this at home: putting a propane-powered engine onto a bicycle.
Mysteries of Science

Cartoon of the Day

"Explain to me again why enjoying life when I retire is more important than enjoying life now."
Copyright © Randy Glasbergen

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