Oct 23, 2018
|
Can a CTE Mismatch Cause Reliability Problems?
Does usage of BGAs, QFNs or SONs have an increased risk for reliability of solder joints due to the CTE mismatch with the base board material FR4? Jim Hall and Phil Zarrow, The Assembly Brothers, offer their own experiences. Board Talk
|
|
|
|
|
|
|
|
|
|
|
|
|
Help With Lead to Hole Ratio
What is the proper minimum gap between a round conductor lead and the PCB hole that will allow proper solder fill? Where can I find the recommended guideline? Board Talk
|
|
|
|
|
|
|