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Nov 27, 2018

Will Typical No Clean Paste Pass an SIR Test?

Will a typical no clean paste pass an SIR test? Is it really clean enough for a conformal coating and 20 years of service? The Assembly Brothers, Jim Hall and Phil Zarrow, share their own experiences and insight.
Board Talk

Partially Visible or Hidden Solder Connections
Being a CM, it is not feasible to add an X-Ray inspection to the process due to added cost. How do others in the industry handle this?
Ask the Experts

Technical Papers

■	Using Vias to Improve PCB Density
■	Improving Quality with Automatic Solder Nozzle Tinning
■	Enabling IPX Level 7/8 PCB Waterproof Protection
■	Conformal Coatings that don't crack under pressure
■	Important Ways of Approaching Heat Management
■	PCB Prototyping for Smarties
■	Why Jobs Go On Hold
■	Case Studies Demonstrate Value-Added Services to Enable Client Success

Returning to Basics in the SMT Screen Printing Process
This paper showcases a new stencil process that was discovered by reverting to the basics.
Production Floor

The 5G Future Is Almost Here
Investments in 5G-compatible spectrum show economic promise of 5G wireless technology, slated to be rolled out in developed economies in 2019.
Technology Briefing

Reliability of Lead-Free LGAs and BGAs
A theory is proposed that substantial differences in SAC305 solder joint Sn grain morphology may explain, at least partially.
Analysis Lab

Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Paper presents the reliability of LGA components assembled with tin-lead solder onto PCBs with an ENEPIG finish and subjected to thermal cycling and aging.
Materials Tech

Press Fit Roadmap for High Performance Process
Paper investigates the roadmap for press fit technology, with attention to placement and insertion, inspection, repair, pin design, challenges and solutions.
Production Floor

Solder Splashing During Wave Soldering
We are experiencing solder splash while using both adjustable and dedicated pallets. What is the likely reason for this?
Ask the Experts

Simulation of Embedded Component
Embedded components technology has launched its implementation in volume products demanding for highest miniaturization level.
Analysis Lab

What is Causing Dimples in Blind Via Pads?
Recently we encountered defects on some bare boards from our supplier. The defect is a small dimple. What might be the cause of this defect?
Board Talk

Screening of Lower Melting Point Pb-Free Alloys
Program explores the manufacturability and reliability for Pb-free Bi-containing alloys in comparison with conventional SAC305 and SnPb assemblies.
Materials Tech

Self-Driving Vehicles: From Prototypes to Commercial Success
From real estate and jobs to insurance and law enforcement, no digital application will have more far-reaching consequences than self-driving cars and trucks.
Technology Briefing

Soldering Immersion Tin
This paper focuses on awareness of factors attributed to soldering i-Sn including IMC formations in relation to reflow cycles and solderability performance.
Production Floor

Solder Paste Mixing
How can we confirm that our centrifuge machine is properly mixing jars of solder paste to give us the results as per the standard requirement?
Ask the Experts

Radioactivity Warning Surprise
A chemist had a hunch that radioactive contamination might have come from a window. How could a window be the cause?
Mysteries of Science

Cartoon of the Day

"90% of the things we worry about never actually happen. So I'd like everyone to do a lot more worrying!"
Copyright © Randy Glasbergen

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