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February 7, 2020
In this issue
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Top Stories
The history and future of DRAM architecture in different application domains: An analysis
Common trends and bottlenecks in DRAM architecture are identified. More>>
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MEMS-FHE device integration gets real
Integrating MEMS with Flexible Hybrid Electronics (FHE) is an important step in the evolution of this miniaturized intelligent sensing technology, paving the way for its use in new classes of flexible, conformal devices. More>>
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Tech News
Flexible hybrid electronics come to bio-interfacing and biodegradable electronics at FLEX-MSTC 2020
VTT Technical Research Centre of Finland Ltd (VTT) has its sights set high. More>>
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A gold butterfly can make its own semiconductor skin
A nanoscale gold butterfly provides a more precise route for growing/synthesizing nanosized semiconductors that can be used in nano-lasers and other applications. More>>
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Business News
Xperi enters into new patent and technology license agreement with SK Hynix
Xperi Corporation announced that it entered into a new patent and technology license agreement with SK hynix, one of the world’s largest semiconductor manufacturers. More>>
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Week's Top Articles
Nanoscale features through atomic layer processing
Atomic layer etching and deposition processes offer atomic scale control through the use of self-limiting reactions. More>>
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Abating potentially dangerous particles 2.5 µm and smaller
Particles, especially fine particles, are very important because of their impact on human health. More>>
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Web Editor
Shannon Davis
603-547-5309
sdavis@semiconductordigest.com 
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