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Jan 10, 2019

BGA Components and Coplanarity

We have a PCB with a HASL surface finish, the assembly includes a 256 ball BGA. The component balls are .6 mm pitch. Is coplanarity a concern? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk

Selective Soldering Frame Causing Cold Solder Joints
We have continual problems with cold solder joint on our wave soldering system. Could these be caused by using a selective soldering frame?
Ask the Experts

Technical Papers

■	Extending MRS Sensor Technology to Address Challenging Applications
■	Solving Problems Before They Occur in PCB Design to Manufacture
■	Using Vias to Improve PCB Density
■	Improving Quality with Automatic Solder Nozzle Tinning
■	Enabling IPX Level 7/8 PCB Waterproof Protection
■	Important Ways of Approaching Heat Management
■	PCB Prototyping for Smarties
■	Why Jobs Go On Hold

Selective Removal of Conformal Coatings by Pulsed Ultraviolet Lasers
To miniaturize electronics conformal coating removal solution needs to provide fine cut resolutions, witout compromising quality, cost, and throughput.
Production Floor

Ultra-low Power Injectable Biosensors
Engineers have developed a miniature, ultra-low power injectable biosensor that could be used for continuous, long-term alcohol monitoring.
Technology Briefing

Acoustic Micro Imaging Analysis for 3D Packages
This paper will present a review of AMI methods that are applicable to analyses of 3D devices and show example applications.
Analysis Lab

High Reliability, Stress-free Copper Deposit
To overcome the challenge of metallizing smooth surfaces, a new stress-free electroless copper was developed to serve this important sector.
Materials Tech

Optimizing Immersion Silver Chemistries For Copper
Study evaluated several types of additives. Data on thickness distribution, copper attack rate, and deposit porosity resulted in new theories on how to control immersion silver.
Production Floor

MSD Components Baked Too Long
If MSD components are baked for more time than specified in J Std, can this cause potential failures or other problems?
Ask the Experts

Influence of Manufacturing Quality on Thermomechanical Stress of Microvias
The advancement of area-array packages has driven the adoption of high density interconnects that allow for an increased I/Os.
Analysis Lab

Problem Meeting Minimum Hole Fill During Wave Soldering
We are having problems achieving the minimum hole fill of 75% on electrolytic capacitors using our wave soldering. What do you suggest?
Board Talk

Reliability of Fine Pitch Flip Chip BGA Packages for Automotive Applications
The board level reliability of different FCBGA packages was evaluated in the automotive thermal cycling environment.
Materials Tech

The Portable Smartphone Laboratory
Researchers have developed a low-cost, portable laboratory on a smartphone that works nearly to detect viral and bacterial infections.
Technology Briefing

Profiled Squeegee Blade Review
Paper presents performance of the profiled squeegee blade developed to create a multi-angle of attack for process control for all types of stencil printing processes.
Production Floor

Customer Approval for Repairs
We have a case where a customer's board was repaired without authorization. Does IPC specify that customer approval is required for class 3 repairs?
Ask the Experts

Why Ford Asked for Lower Quality
Ford Motor Company was addressing a consistency issue. Inventory parts had a slight gold cast, but the new ones were a perfect "chrome white".
Mysteries of Science

Cartoon of the Day

"We're implementing new security standards in the office, so don't forget to use the ecret-say ode-cay!"
Copyright © Randy Glasbergen

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