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Feb 5, 2019

Hand Soldering Reliability

Can you comment on potential differences in reliability for SMT machine placement followed by reflow soldering vs. hand placement followed by hand soldering in surface mount? The Assembly Brothers, Jim Hall and Phil Zarrow, address this question.
Board Talk

Exposed Copper Risk
This PCB is used in an outside environment exposed to high humidity and temperatures extremes. Should we be concerned with corrosion? What should we do?
Ask the Experts

Technical Papers

■	Heat Flow in Reflow
■	Characteristics of EPIG Deposits for Fine Line Applications
■	Next-Gen, High-Temp Capable Underfill
■	Extending MRS Sensor Technology to Address Challenging Applications
■	Solving Problems Before They Occur in PCB Design to Manufacture
■	Using Vias to Improve PCB Density
■	Improving Quality with Automatic Solder Nozzle Tinning
■	Enabling IPX Level 7/8 PCB Waterproof Protection

The Versatile Preform
This paper discusses attributes within the solder families that the preforms are composed of and considerations when considering solder preforms.
Production Floor

The 5G Future Is Almost Here
Investments in 5G-compatible spectrum show economic promise of 5G wireless technology, slated to be rolled out in developed economies in 2019.
Technology Briefing

Reliability Study of Low Silver Alloy Solder Pastes
Paper presents the reliability study of lead-free solder joints reflowed using various lead-free alloy solder pastes after thermal cycling tests.
Analysis Lab

Semi-Additive Process for High Frequency Signal Substrates
A new SAP process for low loss build-up materials with low desmear roughness and excellent adhesion at various processing conditions is covered.
Materials Tech

Through-Hole Rework for Challenging Components
The successful transition of low and mid-range servers to lead-free has come largely through wave solder process optimization and the use of alternate lead-free alloys.
Production Floor

Blow Holes and Disturbed Joints
We are finding many blow holes and disturbed joints after reflow. The process is non RoHS. What could be going wrong?
Ask the Experts

Side Wall Wetting Induced Void Formation
In this study the authors examine the mechanism of void formation in the processing of microbumps.
Analysis Lab

No-Clean Residue Shorts
We have a PCBA with a QFN 44 using no-clean flux. We have many test failures during testing. Are the failures due to flux reside between terminations?
Board Talk

HCFC-225 Phaseout, What Now?
The use restrictions on HCFC-225 are in effect throughout the US. This paper discusses the options for assemblers and component manufacturers.
Materials Tech

Self-Driving Vehicles: From Prototypes to Commercial Success
From real estate and jobs to insurance and law enforcement, no digital application will have more far-reaching consequences than self-driving cars and trucks.
Technology Briefing

Cost Effective 3D Glass Microfabrication
In this extended abstract we present 3D Glass Solutions' efforts in using our proprietary APEX Glass ceramic to create various interposer technologies.
Production Floor

Conformal Coating Press Fit Connectors
We are having problems with press-fit connectors. We produce military circuit board assemblies and currently use a single component, acrylic conformal coating.
Ask the Experts

Polymer Thick Film That Was Thinned Out
A factory is making circuits using polymer thick film. One day the ink was too thin, making it print poorly. What was causing this?
Mysteries of Science

Cartoon of the Day

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