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Electronics Assembly Knowledge, Vision & Wisdom
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October 6, 2022
Is No-Clean the Trend for QFN Components?
Is No-Clean the Trend for QFN Components?
Is there a move to no-clean for QFN components, or will certain technologies have to continue using a traditional cleaning process? The Assembly Brothers, Phil Zarrow and Jim Hall, answer this question and share their own experiences.
Board Talk
Risk Mitigation in Hand Soldering
A new validation technology in concert with visual inspection represents a change to the status quo in hand soldering.
Production Floor
Effects of Long-Term Storage on Mechanical and Electrical Integrity
Selective Equipment in Spec?
Why the need for 3D SPI?
Dealing with the Results of the Pandemic
Direct Immersion Gold as a Final Finish
Essential Practices for Gold Mitigation of Electronic Components
Nearshoring or Contract Manufacturing? Which Fits Your Business Model?
Solder Alloy Contribution to Robust Selective Soldering Process
The Four Roles of Inspection Data in a Smart Factory
Toward the Lights-out Factory
Ask the Experts
Requirement for Toe Fillets
I am a junior inspector at an electronics manufacturing service. I ran into a little bit of confusion regarding what is the requirement for a toe fillet. Figure 8-89 ...
Ask the Experts
Circuit Insight
Circuit Insight
Mastering Innovation's Toughest Trade-Offs
Mastering Innovation's Toughest Trade-Offs
Innovation in dynamic environments is rife with critical tensions. When left unaddressed or mishandled, these tensions sink teams and organizations.
Technology Briefing
Solder-Joint Reliability of a 0.65 mm Pitch Molded Array Package for Automotive
The primary objective of this study was to baseline the solder-joint thermal fatigue life for the POR (plan of record) package.
Analysis Lab
Circuit Insight
Circuit Insight
Microalloyed Sn-Cu Pb-Free Solder for High Temp
Microalloyed Sn-Cu Pb-Free Solder for High Temp
While susceptibility to tin whisker growth remains a barrier to the transition to Pb-free, there is now general acceptance that there are reliable alternatives.
Materials Tech
2.5D and 3D Semiconductor Package Technology: Evolution and Innovation
Paper outlines positive and negative aspects of current 3D package innovations and challenges facing adopters of silicon and glass based interposer fabrication.
Production Floor
Circuit Insight
Circuit Insight
Ask the Experts
ENIG Solderability Issues
We are facing solderability issues on a particular lot of electroless nickel - immersion gold plated circuit boards. The nickel thickness measured with an XRF ...
Ask the Experts
Design Variables of Thermoforming Process on Printed Electronic Traces
This experiment provides insight into future design guidelines and process intellectual property for manufacturing printed electronic products.
Analysis Lab
Circuit Insight
Circuit Insight
Acceptable Rate for Head in Pillow?
Acceptable Rate for Head in Pillow?
We have rejects in 2-3 per 15,000 PCBs that look like Head in Pillow. Should we tinker with the reflow process, or is this reject rate acceptable?
Board Talk
High Performance Light and Moisture Dual Curable Encapsulant
This study is focused on liquid glop top encapsulants that are placed over the PCB components and wire bonds as a protective layer.
Materials Tech
Supplier Spotlight
IMDES Creative Solutions
IMDES Creative Solutions is a German manufacturer and supplier of ...
Dover Motion
Dover Motion is a division of Invetech, a full-spectrum product ...
Syncro Corporation
Syncro Corporation is a privately-held manufacturing and systems integration company ...
Lightspeed Manufacturing
From rapid prototyping to manufacturing at scale, we strive to ...
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Diodes As One Way Regulator Valves
Diodes As One Way Regulator Valves
Diodes are in nearly every electronic device, acting as one-way regulator valves. Diodes allow electricity to flow in only one direction through the device.
Technology Briefing
Circuit Insight
Fill the Void II: An Investigation into Methods of Reducing Voiding
This paper is a continuation of previous work on voiding. The voiding results are summarized and recommendations made for reduction of voiding.
Production Floor
Circuit Insight
Corrosion and Contaminant Diffusion Multi-Physics Model
Models for copper interconnect degradation are needed for life prediction modeling to ensure 10-year, 100,000 mile reliability for automotive applications.
Analysis Lab
Circuit Insight
Sealed Membrane Switch Mystery
Sealed Membrane Switch Mystery
A factory was building membrane switches but all the switches from units in Denver failed. What was unusual about Denver?
Mysteries of Science
Circuit Insight
Cartoon of the Day
Cartoon
"Morale is worse than we thought. A computer just signed up for our stress management workshop!"
Copyright © Randy Glasbergen

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