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October 25, 2022
How To Verify Cleanliness After Rework and Prior to Re-coating?
How To Verify Cleanliness After Rework and Prior to Re-coating?
Rework on a coated assembly happens often. How do you verify cleanliness of the rework site prior to re-coating? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this question and share their own experiences.
Board Talk
Cohesive Zone Modeling of Failure Underfilled BGA-PCB Assemblies
A model was developed to simulate the delamination behavior of multilayer PCBs assembled with BGA components reinforced with an underfill epoxy adhesive.
Production Floor
X-Ray Supports Quality Assurance, Counterfeit Detection
Be Selective in Partnering with a Soldering Equipment Supplier
Effects of Long-Term Storage on Mechanical and Electrical Integrity
Selective Equipment in Spec?
Why the need for 3D SPI?
Dealing with the Results of the Pandemic
Direct Immersion Gold as a Final Finish
Essential Practices for Gold Mitigation of Electronic Components
Nearshoring or Contract Manufacturing? Which Fits Your Business Model?
Solder Alloy Contribution to Robust Selective Soldering Process
Ask the Experts
Dam & Fill vs. Conformal Coating
Are there any special reasons or advantages to use Dam & Fill compared to conformal coating? Is Dam & Fill primarily used to provide additional mechanical ...
Ask the Experts
Circuit Insight
Circuit Insight
Demography AI and the Future of Economic Growth
Demography AI and the Future of Economic Growth
Our lives are shaped by demographic and techno-economic trends. A demographically driven change intersects history’s greatest techno-economic wave.
Technology Briefing
Void Reduction in Bottom Terminated Components Using Vacuum Assist
Paper offers results of void experiments using an in-line convection reflow oven and three types of bottom terminated components.
Analysis Lab
Circuit Insight
Circuit Insight
Low-Cost & High Performance Silicon Interposers
Low-Cost & High Performance Silicon Interposers
The Low-Cost Silicon Interposer industry consortium addresses limitations of organic packages as well as wafer-based silicon interposers.
Materials Tech
Jetting Solder Paste Opens Up New Possibilities
The differences between jet printing and dispensing will be highlighted and technical challenges with broad band technology will be discussed.
Production Floor
Circuit Insight
Circuit Insight
Ask the Experts
Question About PPM Defect Rate for Reversed Packages
Which process/equipment has the higher ppm defect rate for reversed packages: SMT pick-and-place or component taping-and-reeling? I have seen some PCBs with ...
Ask the Experts
Second Round Robin Evaluation of iNEMI Creep Corrosion Qualification Test
The paper reports the results of the iNEMI creep corrosion qualification test and compares them to the first round robin test and recent mixed-flowing gas test results.
Analysis Lab
Circuit Insight
Circuit Insight
Assembling Boards with BGAs on Both Sides
Assembling Boards with BGAs on Both Sides
What are the pros and cons of assembling circuit boards with BGA components on both sides? Should we first place BGAs on side one or side two?
Board Talk
Hybrid Sintering for High-power Density Devices Aerospace Applications
This paper presents the results of a study aimed at developing high-power density devices for aerospace applications.
Materials Tech
Supplier Spotlight
Momentive Performance Materials Inc.
Our global silicones business brings innovation to a wide range ...
Advanced Circuits
Advanced Circuits has led the PCB industry for over 25 ...
American Hakko Products, Inc.
Hakko has been producing superior quality soldering and desoldering tools, ...
IAC Industries
Welcome to IAC Industries. Our name represents the merged product ...
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Artificial Intelligence System Can Track Autonomous Aircraft
Artificial Intelligence System Can Track Autonomous Aircraft
A new AI system can track aircraft; predict the intent of other aircraft; coordinate with their actions; and communicate with pilots and air traffic controllers.
Technology Briefing
Circuit Insight
Screen Making for Printed Electronics
This study presents a DOE method to pre-test materials to categorize ink and substrate rheology, compatibility and printed feature requirements.
Production Floor
Circuit Insight
Modeling a SMT Line to Improve Throughput
With tools to model a large quantity of products and the impact of SMT line configurations, an electronics assembly plant can be analyzed to identify improvement opportunities.
Analysis Lab
Circuit Insight
Resistor Values off the Mark
Resistor Values off the Mark
Suddenly values for screened resistors on ceramic circuits were way too high. What caused the sudden high values?
Mysteries of Science
Circuit Insight
Cartoon of the Day
Cartoon
"Let's compromise - I'll agree to raise your salary if you'll agree to talk me out of it."
Copyright © Randy Glasbergen

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