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October 13, 2022

Problem Meeting Minimum Hole Fill During Wave Soldering

We are having problems achieving the minimum hole fill of 75% on electrolytic capacitors using our wave soldering. What do you suggest? The Assembly Brothers, Phil Zarrow and Jim Hall, share their suggestions and experience.
Board Talk

Voiding Control On Bottom Terminated Components Using Preforms
This paper looks at a new approach using readily available solder fortification preforms.
Production Floor

Technical Papers

■	Effects of Long-Term Storage on Mechanical and Electrical Integrity
■	Selective Equipment in Spec?
■	Why the need for 3D SPI?
■	Dealing with the Results of the Pandemic
■	Direct Immersion Gold as a Final Finish
■	Essential Practices for Gold Mitigation of Electronic Components
■	Nearshoring or Contract Manufacturing? Which Fits Your Business Model?
■	Solder Alloy Contribution to Robust Selective Soldering Process
■	The Four Roles of Inspection Data in a Smart Factory
■	Toward the Lights-out Factory

Stainless Steel Benches and ESD
I do some contract work for a company that uses stainless steel benches in both their assembly area and test lab. I'm having trouble making the case to replace them ...
Ask the Experts

Stackable Reconfigurable Artificial Intelligence Chip
We are a step closer to a LEGO-like design for a stackable, reconfigurable artificial intelligence chip, comprising layers of sensing and processing elements.
Technology Briefing

RoHS: 10 Years Later - IT Equipment Corrosion Issues Remain
This paper will describe the common modes of corrosion-related hardware failures in the past 10 years and the means of negating their detrimental effects.
Analysis Lab

Semi-Additive Process for High Frequency Signal Substrates
A new SAP process for low loss build-up materials with low desmear roughness and excellent adhesion at various processing conditions is covered.
Materials Tech

Video Analysis of Solder Paste Release from Stencil Printing
Solder paste release from the stencil is a critical factor in print quality. An experiment used a video microscope to capture the separation of the stencil.
Production Floor

Bottom Side Chip Bonding
When should we use adhesive to bond SMT components to the bottom side of a double sided PWA before going thru reflow soldering? Component size, weight, etc.
Ask the Experts

Fatigue and Shear Properties of High Reliable Solder Joints
In this study, individual high-reliability SnAgCu based solder joints (Innolot, MaxRel, Ecolloy) were tested to investigate their shear and fatigue properties.
Analysis Lab

What is Solder Paste Working Life on a Stencil?
Our solder paste has an exposure life of ten hours. After ten hours of operation do we need to remove all of the paste on the stencil and scrap it?
Board Talk

HCFC-225 Phaseout, What Now?
The use restrictions on HCFC-225 are in effect throughout the US. This paper discusses the options for assemblers and component manufacturers.
Materials Tech

Supplier Spotlight

Robotas Technologies Ltd.
The ultimate goal for Robotas Technologies is to deliver smart ...

Nikon Metrology, Inc.
For over 100 years, Nikon has pursued the possibilities of ...

IEC Electronics Corp.
By utilizing our on-site analytical laboratories or our proven industry ...

Ohmega Technologies, Inc.
For five decades OhmegaPly has been used in a variety ...

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Algorithm Planner to Delegate Tasks to Robots
Researchers developed an algorithmic planner that helps delegate tasks to humans and robots. It considers a list of tasks and decides how to assign them.
Technology Briefing

Optimization of Stencil Apertures to Compensate for Scooping
This study investigates the scooping effect during solder paste printing as a function of aperture width, aperture length and squeegee pressure.
Production Floor

Effect of Fine Lead-Free Solder Powder on the Reflow Property Pastes
This paper evaluates the effect of particle size distribution and oxidation on the reflow performance of solder paste.
Analysis Lab

The Overheated Professor
A professor was having hot flashes. Was it a medical condition or something else? Could his students be involved?
Mysteries of Science

Cartoon of the Day

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