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October 27, 2022

Component Moisture Question?

We mistakenly assembled circuit boards using BGA components that were not properly stored. Can we now rebake the assemblies? Phil Zarrow and Jim Hall, The Assembly Brothers, dicsuss this scenario and offer their suggestions.
Board Talk

Design for Testability to Overcome Functional Board Test Complexities
In this paper the author reviews how Design for Testability techniques can be an effective way to reduce functional board test programming complexity.
Production Floor

Technical Papers

■	X-Ray Supports Quality Assurance, Counterfeit Detection
■	Be Selective in Partnering with a Soldering Equipment Supplier
■	Effects of Long-Term Storage on Mechanical and Electrical Integrity
■	Selective Equipment in Spec?
■	Why the need for 3D SPI?
■	Dealing with the Results of the Pandemic
■	Direct Immersion Gold as a Final Finish
■	Essential Practices for Gold Mitigation of Electronic Components
■	Nearshoring or Contract Manufacturing? Which Fits Your Business Model?
■	Solder Alloy Contribution to Robust Selective Soldering Process

Exposed Copper Defect
Is exposed copper considered a class 3 defect per IPC-610 or J-STD documents?
Ask the Experts

From Internal Combustion Engines to Hydrogen Fuel-Cell Electric Vehicles
Researchers have developed a precious-metal-free hydrogen fuel cell produces more than 200 milliwatts per square centimeter.
Technology Briefing

Moisture Effects in Common Solderable RF Connector Dielectrics
The tendencies of commonly used RF connector polymeric materials to absorb and desorb moisture under various humidity and temperatures are characterized.
Analysis Lab

Improving properties of a Lead-free Solder Alloy with Doping of Copper
This paper reviews 3 lead-free solder alloys to assess the mechanical and thermal cycle properties by implementing drop tests and thermal cycle tests.
Materials Tech

Fine Pitch Flip Chip Assembly Process Underfill, Evaluation and Reliability
The paper compares the best flux and underfill combination in reliability performance was selected and applied to the production process.
Production Floor

Dam & Fill vs. Conformal Coating
Are there any special reasons or advantages to use Dam & Fill compared to conformal coating? Is Dam & Fill primarily used to provide additional mechanical ...
Ask the Experts

Pad Crater Initiation in Shock Using Acoustic Emission Detection
Dye stain and cross section failure analysis techniques were used to identify pad crater damage and showed good agreement with the acoustic events.
Analysis Lab

Causes of Blowholes
Are old components such as resistors and circuit breakers more likely to cause blowholes during wave soldering compared to newer components?
Board Talk

Effect of Bi Content on Properties of Low Silver SAC Solders
A systematic study is presented to address the effect of Bi content on soldering and mechanical performance of low silver SAC alloys.
Materials Tech

Supplier Spotlight

X-Treme Series Auto Dry Cabinets
As X-Treme Series Auto Dry Cabinets, we provide smart storage ...

Super PCB
Super PCB is the source for all your high-quality PCB ...

GreenSoft Technology, Inc.
GreenSoft Technology, Inc. is a leading provider of environmental compliance ...

Advanced Thermal Solutions, Inc.
Advanced Thermal Solutions, Inc is a leading-edge engineering and manufacturing ...

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Get Ready for the Great 2020s Automation Surge
The world is in the midst of a cultural, technological, geopolitical and demographic transition. That transitional process is roiling our economy and our society.
Technology Briefing

The Dynamics of Low Stress Epoxy Curing
This study compares uniform variable frequency microwave (VFM) field cure to standard oven curing at temperatures below Tg (transition temperature).
Production Floor

Selective Soldering Design for Reliability Using a Novel Test Board and SIR Test Method
The purpose of this research is to develop a test method designed to evaluate the electrochemical reliability of the selective soldering process at the assembly site.
Analysis Lab

The Puzzling Z-Axis Adhesive
A new type of z-axis conductive adhesive was mysteriously switching on and off. The cycle was endlessly repeated. What was the cause?
Mysteries of Science

Cartoon of the Day

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