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November 15, 2022

What is Causing Long-Term Soldering Joint Cracking in Automotive Application?

We are seeing field returns due to solder joint cracking on the pin of a 16-pin through-hole connector. What might be the cause of the joint cracking? Phil Zarrow and Jim Hal. The Assembly Brothers, address this question.
Board Talk

Novel Pogo-Pin Socket Design for Automated Linearity Testing
A novel pogo-pin block array and corresponding motorized test socket has been designed to stimulate the MCM and acquire full functional test data.
Production Floor

Technical Papers

■	X-Ray Supports Quality Assurance, Counterfeit Detection
■	Be Selective in Partnering with a Soldering Equipment Supplier
■	Effects of Long-Term Storage on Mechanical and Electrical Integrity
■	Selective Equipment in Spec?
■	Why the need for 3D SPI?
■	Dealing with the Results of the Pandemic
■	Direct Immersion Gold as a Final Finish
■	Essential Practices for Gold Mitigation of Electronic Components
■	Nearshoring or Contract Manufacturing? Which Fits Your Business Model?
■	Solder Alloy Contribution to Robust Selective Soldering Process

Spotting After DI Water Cleaning
We have a close loop 3 Bed DI System fitted with a resistivity monitor. When the beds are new we generally generate water at approximately 18 Mega Ohms. This ...
Ask the Experts

Solar Powered Robots with Electronic Brains
As reported in Science Robotics, researchers have installed electronic "brains" on solar-powered robots that are smaller than an ant's head.
Technology Briefing

Low Temperature Solder Interconnect Reliabiilty in Enterprise Computer and Automotive Electronics
This article studies a new low melting temperature solder interconnect application and reliability on various product categories.
Analysis Lab

Low Temperature Solder Alloys for Portable Electronics
This paper discusses low temperature Pb-free alloys, which are capable of delivering high reliability performance at low soldering temperatures.
Materials Tech

Combing Automated Advanced Process Control with Feedback to Revolutionize the Printed Circuit Board Assembly Process
This presentation will explore Industry 4.0, and then explore how Advanced Process Control (APC) can increase production yields and reduce defects.
Production Floor

A Generic Reflow Profile
We have a wide mix of PCB assembly types. Some folks here are proposing that we use the same reflow profile setting regardless of the PCB thickness, thermal ...
Ask the Experts

Extended-Time Process Consistency and Process-Property Relationships for Flexible Additive-Printed Electronics
In this paper, a detailed study of the effect of aerosol-jet process parameters on the resistance, shear strength, and elastic modulus has been presented.
Analysis Lab

Hand Soldering Reliability
What are the differences in reliability for SMT machine placement followed by reflow vs. hand placement followed by hand soldering in surface mount?
Board Talk

Jet-Dispensed SMT Adhesives for Durable Printed Electronics
This paper discusses the use of jet-dispensed SMT adhesives for increased durability, lower component cost, and new form factor printed electronics.
Materials Tech

Supplier Spotlight

Beta LAYOUT
The Beta LAYOUT group, with 170 employees and over 28,000 ...

Apollo Seiko
Apollo Seiko was founded in 1969 by George Kawaguchi. Mr. ...

Nutek Americas, Inc
Nutek Private Limited (Nutek) conceptualizes, designs and manufactures automated production ...

Wise srl
Wise the Italian international technology leading company of Wet Processing ...

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A Future 3D Printing Robots
3D printers could churn out devices that are more flexible, dynamic and potentially more useful. The results could include wearable electronic devices and more.
Technology Briefing

Vapor Phase - Improvement Under Oxidation Free Soldering Conditions
Modern vapor phase soldering systems based on new technologies have eliminated the disadvantages inherent to condensation systems.
Production Floor

Assessment of 2nd Level Interconnect Quality in Flip Chip Ball Grid Array Package
Wire bonding is extensively used in the electronic packaging industry. One of the difficulties with flip chip technology is testing its reliability.
Analysis Lab

Innovative Impromptu Air Conditioning
One July the chiller at an old factory was using more electricity than normal. What was causing the chiller to use more electricity?
Mysteries of Science

Cartoon of the Day

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