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November 10, 2022

Does HASL or ENIG Reduce Creep Corrosion in Corrosive Environments?

We make electronics equipment used in corrosive environments. Do you recommend the use of HASL versus immersion gold for our application? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this scenario and offer their recommendations.
Board Talk

Stencil Printing Yield Improvements
The wipe sequence, wipe frequency and wipe solvent and how these interact to provide solder paste printing yield improvement is studied.
Production Floor

Technical Papers

■	X-Ray Supports Quality Assurance, Counterfeit Detection
■	Be Selective in Partnering with a Soldering Equipment Supplier
■	Effects of Long-Term Storage on Mechanical and Electrical Integrity
■	Selective Equipment in Spec?
■	Why the need for 3D SPI?
■	Dealing with the Results of the Pandemic
■	Direct Immersion Gold as a Final Finish
■	Essential Practices for Gold Mitigation of Electronic Components
■	Nearshoring or Contract Manufacturing? Which Fits Your Business Model?
■	Solder Alloy Contribution to Robust Selective Soldering Process

Baking Old PCBs Prior To Reflow
Our standard procedure for new bare PCBs is to bake at 125C if the date code is greater than six months old. These PCBs are sealed in plastic from the supplier. The packages ...
Ask the Experts

Algorithm Planner to Delegate Tasks to Robots
Researchers developed an algorithmic planner that helps delegate tasks to humans and robots. It considers a list of tasks and decides how to assign them.
Technology Briefing

Reworkable Edgebond Applied Wafer-Level Chip-Scale Package
This paper presents data showing that localized distribution of recrystallized grains is an accurate indicator of solder joint life-cycle degradation and enhancement.
Analysis Lab

Designing a High Performance Electroless Nickel and Immersion Gold
It was the goal of this paper to overcome myths and misunderstandings within the PCB manufacturing environment regarding the HP ENIG finish.
Materials Tech

The Development of Hybrid Therma-EMI Solutions for Electronics
Test methods to measure the thermal and electromagnetic properties of a material in an application and as fundamental material properties are discussed.
Production Floor

How To Remove Oxidation On SMT Components
What process do you recommend for removing oxidation from SMT components? These components are unsolderable due to the surface finish.
Ask the Experts

The New Standard for Cyber Security
Productivity can be improved by implementing, catching counterfeits and counterfeiters closer in time and physical distance than ever before by taking a systematic approach.
Analysis Lab

Opens With Assembled QFN Components
We are experiencing opens on assembled QFN components at a rate of 9%. The failure only appears in rows near the component center. What is happening?
Board Talk

Conformal Coatings in Preventing Resistor Silver Sulfide Corrosion
The evaluation of conformal coatings to mitigate silver sulfide corrosion of thick film resistors is discussed.
Materials Tech

Supplier Spotlight

RG Advertising
We offer a totally comprehensive range of services - all ...

ICAPE Group
ICAPE Group offers the best services for an optimal quotation ...

all4-PCB (North America) Inc.
Supplies equipment for PCB industry including automation, wet process and ...

Balver Zinn Josef Jost GmbH & Co. KG
The head office of Balver Zinn Josef Jost GmbH & ...

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Stackable Reconfigurable Artificial Intelligence Chip
We are a step closer to a LEGO-like design for a stackable, reconfigurable artificial intelligence chip, comprising layers of sensing and processing elements.
Technology Briefing

Reduce Pollution of Process Gasses in an Air Reflow Oven
This paper gives detailed information of catalyst systems designed and implemented in SMD production lines to reduce pollution of process gasses.
Production Floor

Rework and Reball Challenges for Wafer-Level Packages
The present work addresses the rework and reball challenges of a specific WLP case study, and suggests improvements for maintaining the true failure signature.
Analysis Lab

Epoxy Resin and the Red Gas Cloud
A chemist mixed epoxy and a catalyst that caused an overheated reaction producing a reddish gas cloud. What caused this reaction?
Mysteries of Science

Cartoon of the Day

"If it occurs every afternoon and lasts for less than 2 hours, then it's probably not a coma."
Copyright © Randy Glasbergen

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