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Electronics Assembly Knowledge, Vision & Wisdom
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November 29, 2022
Can Water Contamination Cause Failure?
Can Water Contamination Cause Failure?
We have an operational circuit board that was accidentally exposed to rainwater for a few hours. Is there a greater likelihood of failure? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this scenario and share their own experiences.
Board Talk
Flip Chip LED Solder Assembly
A pin transfer process was adapted to assemble flip-chip CSP LEDs with fine pitch solder paste to assemble lateral and vertical LEDs on flat substrates.
Production Floor
Keys to Component Lead Tinning Success
X-Ray Supports Quality Assurance, Counterfeit Detection
Be Selective in Partnering with a Soldering Equipment Supplier
Effects of Long-Term Storage on Mechanical and Electrical Integrity
Selective Equipment in Spec?
Why the need for 3D SPI?
Dealing with the Results of the Pandemic
Direct Immersion Gold as a Final Finish
Essential Practices for Gold Mitigation of Electronic Components
Nearshoring or Contract Manufacturing? Which Fits Your Business Model?
Ask the Experts
Stencil Cleaning Frequency
What is the industry standard for the amount of time between stencil cleaning?
Ask the Experts
Circuit Insight
Circuit Insight
Cobalt Supply Chain Problem
Cobalt Supply Chain Problem
Cobalt is one of the most significant supply chain risks threatening widespread adoption of electric cars, trucks and other electronic devices requiring batteries.
Technology Briefing
Cavity Board SMT Assembly Challenges
This study is to identifies the challenges related to assembly of a package into a cavity on the board, and establish the best known method for SMT assembly success.
Analysis Lab
Circuit Insight
Circuit Insight
New High-Performance Organophosphorus Flame Retardant
New High-Performance Organophosphorus Flame Retardant
A non-halogen flame retardant has been developed for high performance applications. Resin performance data are presented.
Materials Tech
Influence of Salt Residues on BGA Head in Pillow
In this paper, a series of experiments was carried over to know the influence of specifically NaCl on BGA wetting given Head in Pillow (HiP) as result.
Production Floor
Circuit Insight
Circuit Insight
Ask the Experts
Exposed Copper Risk
We received many PCB's where a modification have been completed. The modification involved soldering a chip cap to an existing pad and adjacent surface ...
Ask the Experts
Healthcare Gaps That Only Technology Can Fill
Digital Health is comprised of wearable, implantable technology, web and email, mobile technology, software, social networking, data management and analytics.
Analysis Lab
Circuit Insight
Circuit Insight
Do BGA Components Warp During Reflow?
Do BGA Components Warp During Reflow?
We recently reworked a BGA component and the corners all bridged. Can these components be removed and reused if we remove the warp?
Board Talk
Dynamic Bending Reliability of Chip-In Fabrics (CIF) Packaging
In this study, flexible Chip-In-Fabric (CIF) assemblies using anisotropic conductive films (ACFs) and cover layer structure were demonstrated.
Materials Tech
Supplier Spotlight
Nujay Technologies Inc.
The combination of our California headquarters and global manufacturer relationships ...
Kete Plastics Co.,Ltd.
Kete Plastics Co., Ltd. is a manufacturer which is specialized ...
Picotest
Picotest products are designed to simplify measurements while providing the ...
DuPont
After more than 200 years of innovation, DuPont is entering ...
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Artificial Intelligence System Can Track Autonomous Aircraft
Artificial Intelligence System Can Track Autonomous Aircraft
A new AI system can track aircraft; predict the intent of other aircraft; coordinate with their actions; and communicate with pilots and air traffic controllers.
Technology Briefing
Circuit Insight
3D IC Integration Technology Development in China
China's semiconductor foundry and microelectronic packaging industries are embracing the move to join 3D IC integration.
Production Floor
Circuit Insight
Room Temperature Fast Flow Reworkable Underfill for LGA
With the miniaturization of electronics, Land Grid Array has been widely used in consumer electronics, leaving only 20-30 microns gap left between LGA and the substrate.
Analysis Lab
Circuit Insight
Cloudy Copper Plating Bath
Cloudy Copper Plating Bath
At a circuit shop near Los Angeles there was trouble with the copper plating line. Was an impurity getting in the tank and how?
Mysteries of Science
Circuit Insight
Cartoon of the Day
Cartoon
"If you are not completely satisfied with your purchase, eat a big turkey sandwich. I always feel satisfied after a big turkey sandwich."
Copyright © Randy Glasbergen

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