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January 12, 2023

Incoming Circuit Boards - How Clean Is Clean?

We're having cleanliness issues, our assembly processes are not introducing contaminants. Could it be the result of incoming PCB cleanliness? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this situation.
Board Talk

Warpage of Flexible-Board Assemblies with BGAs During Reflow and Post-Assembly
Failure in solder interconnects is a leading cause of reliability failure. Complexity of electronic assembly requires these lead-free interconnects to be reliable.
Production Floor

Technical Papers

■	Investigation & Results on the Phenomenon of "Flying" SMD Components
■	The Transformation of the New Generation of X-ray Machine
■	Master Advanced Packaging Inspection
■	Keys to Component Lead Tinning Success
■	X-Ray Supports Quality Assurance, Counterfeit Detection
■	Be Selective in Partnering with a Soldering Equipment Supplier
■	Effects of Long-Term Storage on Mechanical and Electrical Integrity
■	Selective Equipment in Spec?
■	Why the need for 3D SPI?
■	Dealing with the Results of the Pandemic

SOT (Small Outline Transistor) Body Cracks
We have been facing an issue with SOT body cracks in our PCBA assembly line. What could be the reason behind these cracks? How we can simulate the conditions ...
Ask the Experts

Bifunctional Polymer Allows Strength and Speed in Artificial Muscles
Strength and speed could not be achieved simultaneously because increasing muscle strength slows speed reduces the strength, until now.
Technology Briefing

The Quantitative Assessment of Mixed BGA Joint
An investigation to evaluate the soldering process and the reliability of solder joints of SnAgCu PBGA components formed using the Sn-Pb solder paste.
Analysis Lab

Formulation of a New Liquid Flux for High Temperature Soldering
This paper presents the development of a new liquid flux. Laboratory and beta-site test results for existing fluxes are compared to this new flux.
Materials Tech

Evaluation of Stencil Technology for Miniaturization
The objective of this study is to assess the impact of various stencil materials and fabrication methods on the repeatability of solder paste deposition.
Production Floor

Class 2 vs. Class 3
Where are the mayor differences in class 2 and class 3 other than in the IPC-A-610 standard? In which standards is the difference most significant and notable?
Ask the Experts

i4.0, Are We Really Ready?
This paper evaluates SMT production and inspection machines and attempts to define their potential to act as ‘smart sensors’, the first building blocks towards i4.0.
Analysis Lab

Should We Invest in 3D Optical Inspection?
We are correcting many solder defects. The search for defects is taking too long. Should we go with a 3D AOI system to save inspection time?
Board Talk

Development of Materials Informatics Platform
Materials Informatics is one of the hottest technologies because of its potential to reduce the time and costs of discovering innovative materials.
Materials Tech

Supplier Spotlight

Totech Canada N/A Inc
Totech Canada operates in North America to supply a diverse ...

YXLON International
YXLON International designs and produces radioscopic and CT inspection systems ...

The Branford Group
The Branford Group is a recognized leader in surplus industrial ...

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Algorithm Planner to Delegate Tasks to Robots
Researchers developed an algorithmic planner that helps delegate tasks to humans and robots. It considers a list of tasks and decides how to assign them.
Technology Briefing

Press Fit Roadmap for High Performance Process
Paper investigates the roadmap for press fit technology, with attention to placement and insertion, inspection, repair, pin design, challenges and solutions.
Production Floor

Rework Practices for MicroLEDs and Other Highly Miniaturized SMT Components
This paper will focus on practices and innovative solutions to successfully repair these miniaturized, sensitive and often fragile components.
Analysis Lab

RCA TV Soldering Mystery
Decades ago RCA had a soldering problem. One day nearly half of the assemblies had to be reworked, but nothing seemed amiss at the board shop. What was the cause?
Mysteries of Science

Cartoon of the Day

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