We use intrusive reflow soldering on relays using a lead process. We are challenged to solder relays intrusively in a lead-free process. Jim Hall and Phil Zarrow, The Assembly Brothers, share their own suggestions and recommendations. Board Talk
What Causes Solder Balls During Rework?
During the rework of SMT components on conformal coated boards, we see solder balls appearing at neighboring components. How can this be eliminated? Ask the Experts
Top 5 BGA Rework Challenges to Overcome
As BGA component package dimensions continue to get thinner more are being used in handheld device applications. The challenges of BGA rework is discussed. Analysis Lab
Maximum Board Temperature During Tin-Lead
IPC discusses the maximum top-side board temperature for BGAs to be 150 degrees C during a tin-lead wave solder. How is this temperature was determined? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this scenario. Board Talk