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Electronics Assembly Knowledge, Vision & Wisdom
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March 9, 2023
How Can We Prevent Our 0201 Nozzles From Clogging?
How Can We Prevent Our 0201 Nozzles From Clogging?
We have a formula stencil that had the apertures enlarged to maintain volume while overprinting the ends to keep solder away from the 0201 nozzle. Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this situation and offer their own suggestions and advice.
Board Talk
Double Print Stencils Systems
It is useful in Assemblies that require mixed technologies; including SMT / Through Hole, SMT / Glue attach components, Packages requiring die attach / SMT assembly.
Production Floor
Thermally Conductive Molding Significantly Improves Performance and Reliability
PCB Cleaning - The Basics of Cleaning Series Part 2
Through-Hole Soldering Reliability Without Sacrificing Throughput
The Role of High Payoff Activities in Production Excellence
Safeguarding Electrical Components and Products with Nano-coating Technology
Investigation & Results on the Phenomenon of "Flying" SMD Components
The Transformation of the New Generation of X-ray Machine
Master Advanced Packaging Inspection
Keys to Component Lead Tinning Success
X-Ray Supports Quality Assurance, Counterfeit Detection
Ask the Experts
Water Wash vs. No-clean
How do we decide whether to choose a water wash process, or a no-clean process, for a contract manufacturing purchase order when neither process is mandated ...
Ask the Experts
Circuit Insight
Circuit Insight
Microchips Could Be Used to Activate Excess Dopants
Microchips Could Be Used to Activate Excess Dopants
As microchips continue to shrink, silicon must be doped, or mixed, with higher concentrations of phosphorus to produce the desired current.
Technology Briefing
Solder Mask and Low Standoff Component Cleaning – A Connection?
For this study, the authors wanted to assess the impact of different solder mask options on under component cleanliness.
Analysis Lab
Circuit Insight
Circuit Insight
Pressure-Less Silver Sintering Pastes for Low Porosity Joint and Large Die
Pressure-Less Silver Sintering Pastes for Low Porosity Joint and Large Die
Under pressure-less sintering conditions silver sintering pastes for different sized die attachment to form robust silver joints have been developed.
Materials Tech
QFN I/O Pad Solder Paste Overprint on Thermal Pad Void Reduction
QFN SMT components continue to be increasingly used and also becoming smaller for applications further requiring a high level of thermal performance and reliability.
Production Floor
Circuit Insight
Circuit Insight
Ask the Experts
Storage To Prevent Corrosion
Which storage method will better protect against corrosion, nitrogen or super-dry?
Ask the Experts
Mechanical Behavior of Bi-Containing Pb-Frees
The objective of this research was to characterize the mechanical metallurgy of alternative solder alloys for high-reliability applications.
Analysis Lab
Circuit Insight
Circuit Insight
Keys for Moisture Sensitive Device Control
Keys for Moisture Sensitive Device Control
We attach travelers to every group of MSD components taken out of the moisture barrier bag. Is this enough documents on our MSD program?
Board Talk
DFX on High Density Assemblies
This paper discusses selection of solder paste based on end product and the need to conduct proper root cause analyses before making any material changes.
Materials Tech
Supplier Spotlight
IMDES Creative Solutions
IMDES Creative Solutions is a German manufacturer and supplier of ...
Dover Motion
Dover Motion is a division of Invetech, a full-spectrum product ...
Syncro Corporation
Syncro Corporation is a privately-held manufacturing and systems integration company ...
ACI-PCB, INC.
ACI-PCB, Inc. is a broker supplier of ALL types of ...
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Technology Enables 21st Century Global Stability
Technology Enables 21st Century Global Stability
The cost-benefit case for the United States performing this role is rapidly becoming untenable. With few exceptions, North America is uniquely self-sufficient.
Technology Briefing
Circuit Insight
Taking the LED Pick and Place Challenge
There has been a shift in the lighting industry that has carried over to surface mount technology. What is this shift? Is it the LED revolution?
Production Floor
Circuit Insight
Surface Mount Warpage Case Study
A quantity of surface mount packages were measured by shadow moire metrology to capture warpage levels, as they were heated through a reflow profile.
Analysis Lab
Circuit Insight
Can Motivational Talks Increase Defects?
Can Motivational Talks Increase Defects?
At a factory with high productivity, one worker was skipping break time to increase productivity. Was this causing mysterious defects?
Mysteries of Science
Circuit Insight
Cartoon of the Day
Cartoon
"You're getting pretty good at this stress management thing."
Copyright © Randy Glasbergen

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